一种低热导率高硬度氮化硅陶瓷及其制备方法
Release time:2026-07-06
Hits:
- Patent Applicant:
- 清华大学
- Disigner of the Invention:
- 张师嘉, 刘光华,Chenkexin
- State of Patent:
- 未授权
- Application Number:
- CN202511973886.2
- Service Invention or Not:
- no
- Application Date:
- 2025-12-25
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